Testing Fundamentals

The semiconductor industry faces number of challenges today. There is a demand for more functionality in every die. The most critical aspect is the ever increasing demand for reduced power consumption in mobile devices. The proliferation of high-speed serializers/deserializers has challenged the economics of testing and the strategies adopted for testing. Introduction of newer technologies implies different kind of failure mechanisms previously not encountered. Debugging has reached new levels of sophistication in a rush to capture the market place. The latest trend of 3D packaging technology demands advanced probe based testing.The testing of System on chip and System in package devices demands highest levels of functionality in the test equipment apart from lower cost.

Advantest V93000 series of test equipments have a dual combination of high-speed digital testing and accurate analog,RF measurement integrated into the test system. The features of the test equipment include scalable architecture,low noise effects,modular design among others.Investment optimization has been possible with the use of floating licenses. The application is shared among the users. The life cycle of the test equipment extends with regular development of the platform and the testing community utilizes the equipment to the maximum extent possible.The test systems are extensively used by Outsourced Assembly and Test companies,Integrated device manufacturers, leading foundries all over the world.

Reference

https://www.advantest.com/products/ic-test-systems/v93000-soc-smart-scale