The semiconductor
industry faces number of challenges today. There is a demand for more
functionality in every die. The most critical aspect is the ever
increasing demand for reduced power consumption in mobile devices.
The proliferation of high-speed serializers/deserializers has
challenged the economics of testing and the strategies adopted for
testing. Introduction of newer technologies implies different kind of
failure mechanisms previously not encountered. Debugging has reached
new levels of sophistication in a rush to capture the market place.
The latest trend of 3D packaging technology demands advanced probe
based testing.The testing of System on chip and System in package
devices demands highest levels of functionality in the test equipment
apart from lower cost.
Advantest V93000
series of test equipments have a dual combination of high-speed
digital testing and accurate analog,RF measurement integrated into
the test system. The features of the test equipment include scalable
architecture,low noise effects,modular design among others.Investment
optimization has been possible with the use of floating licenses. The
application is shared among the users. The life cycle of the test
equipment extends with regular development of the platform and the
testing community utilizes the equipment to the maximum extent
possible.The test systems are
extensively used by Outsourced Assembly and Test
companies,Integrated device manufacturers, leading foundries all over
the world.